Adapting Power Electronics for a Renewable-Ready Grid

Replacing fossil-fuel powered transport and meeting global energy needs with climate friendly sources is increasing demand for advanced semiconductor technology and power electronics. Semiconductor devices are developing rapidly to cope with the high voltages required to power transport, provide large-scale energy storage, and optimize domestic renewable energy systems.

Making renewable energy work for the real world

The move away from fossil fuels is not as easy as simply replacing one form of energy generation with another, such as swapping a coal-fired power station with a wind or solar farm. Existing electricity distribution networks need to be upgraded and modified.

Traditional distribution networks are designed for the electricity to flow from the power station directly to the consumer, with production ramping up at peak demand times. A renewable-based energy system is much more complex in matching supply and demand. A solar farm will generate the most electricity when it’s warm and light, however demand for electricity is when it’s dark and cold. Therefore, this generated energy needs to be stored for later use in large batteries, which adds a layer of complexity to existing systems.

These kinds of changes rely on new power electronics. For example, batteries are a direct current (DC) storage device, but most distribution networks operate in alternating current (AC), which means that high power inverters are required to convert between the two. Another complex factor is that domestic solar or wind systems export excess electricity to the grid; instead of one power station generating electricity, there are now thousands of small-scale producers supplying electricity at peak generation times. This means the renewable-based distribution network must allow for electricity flowing both to and from the consumer and monitor that flow to ensure grid stability.

And then there’s the switch to EVs and the associated charging infrastructure. Rapid, high voltage charging on the go puts a huge strain on power systems and can lead ultimately to grid instability. Without any form of smart grid optimization, one study cites  that an increase in EV usage from 25% to 50% may cause a rise in peak power on a power system of 166%. Smart charging that optimizes system parameters to predict demand ahead of time and adjust charging schedules accordingly is predicted to reduce the grid’s peak power demand by 96% compared to conventional, uncoordinated charging.

Trade restrictions dominate the industry

With a world becoming increasingly reliant on high power semiconductor technology, those who have the intellectual property and manufacturing capabilities are in a position of strength within the global semiconductor trading landscape. Seeking to protect domestic interests, in 2022 the US imposed export controls of advanced semiconductor manufacturing equipment for making chips smaller than 14 nm, and limited export of advanced semiconductors. In 2023, China announced export restrictions of germanium and gallium, and later graphite to the list of restricted materials (used in EV batteries). China produces over 90% of the world’s graphite and gallium and 60% of the world’s germanium. However, more recently, China has announced plans to develop their own manufacturing technology, with an investment of $47.5 billion in domestic semiconductor capacity announced in May 2024, reducing their reliance on imported technology.

Increased demand for power electronics

Despite these challenges, the market for semiconductor devices is on the increase, with the solar photovoltaic (PV) power systems market alone predicted to grow at a CAGR of 20% to 2032.

EV consumers and manufacturers are pushing for extended battery range with reduced charging times, which demands higher battery voltages. Currently the industry is transitioning from 400 V to 800 V systems, requiring a redesign of the associated electronics and increasing the demand for power integrated circuits.

This demand is being met in some part by significant technological developments. For example, there’s a move to more resilient semiconductor materials, such as silicon carbide (SiC), that perform well at high voltages, with the CAGR of the global SiC power semiconductor market predicted at 9.5% to 2030.

Silicon Carbide production challenges

Silicon carbide is a relatively brittle material, meaning it is more likely to develop flaws during manufacturing compared with more traditional materials. The wafers are susceptible to pits and scratches and constant performance testing and surface analysis during production is essential. Manufacturers are employing high-current and high-voltage testing on finished assemblies and optical inspection earlier in the IC manufacturing process. XRF techniques are used to spot flaws in chip coatings, reducing the cost of poor quality by picking up defects early in the production process.

XRF for power electronics coatings analysis: the FT200 Series

The FT200 Series of bench top XRF analyzers is designed to help manufactures approach 100% inspection of components. Machine vision software such as Find My Part™ mean that you simply load your substrate, confirm what you want to measure within the software and the instrument will find the right measurement locations on your part – even on very large substrates.  Additional advanced features such as automated focusing and a second, wide-view camera result in dramatically reduced measurement time, which allows you to measure a higher percentage of chip throughput in your facility.

The FT200 Series will analyze up to four coating layers at once plus the substrate, returning accurate thickness and composition results even on small features.

Find out more.




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Date: 13 November 2024

Author: Hitachi High Tech

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