Analyzing lead-free solder in tin alloys with the OE750

Discover a new OES application for analyzing lead-free solder in tin alloys using the OE750 and OE720. This advanced method is specifically engineered to enhance the precision of lead-free solder analysis, featuring extended bismuth calibration for accurate measurement of silver (Ag), bismuth (Bi), and copper (Cu) content. The result is improved reproducibility, greater stability, and enhanced performance in PCB manufacturing and quality control laboratories.

For a deeper understanding, explore the application note below.

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