Whitepaper: Optimizing XRF for micro-scale packaging

The miniaturization of electronics components has been at the forefront of semiconductor device and micro-electronics development since the beginning. Yet, the minute scale of devices that we see today makes producing reliable electronics coatings a significant challenge.

XRF is the established method for verifying the composition and thickness of coatings on electronic devices, but as devices have reduced in size, XRF has had to adapt to meet these new challenges. How can you be sure that you are getting the accuracy and precision you need at a sub-micron level?

To help answer this, we’ve created a detailed guide that covers using XRF to measure very small features. The Essential Guide to XRF analysis for micro-scale packaging is written to help you get the most from your XRF equipment when measuring micro-scale coatings.

The Essential Guide to XRF analysis for micro-scale packaging

Written for those producing micro-scale coatings on PCBs, semiconductor wafers and micro-connectors, this extensive guide covers:

• The natural limits of XRF as a technique, both for resolution of features and elemental range.
  
  
• How the components in your equipment determine the necessary spatial resolution and which technology is best for microelectronics.
  
  
• Realistic analytical tolerances for different plating technologies, such as Au, Ti, Al plating, electroless nickel and RF filter applications.
  
  
• What you should do to increase the efficiency of your XRF analysis for higher throughput.
  
  
• An introduction to the range of Hitachi XRF analyzers designed for micro packaging quality control.

We are undoubtedly pushing XRF beyond traditional limits when we use it to measure electronics coating, which means it’s crucial to get everything right for accurate and precise measurements.