The IPC specifications for printed board surface finishes set the standard for quality and reliability in printed board manufacture today. Adhering to these specifications increases yield and performance, but involves tight process control and accurate measurement of surface finish thickness.
Central to meeting the IPC specifications is the accuracy of XRF measurements to determine surface thickness. In the ‘Manufacturers’ Guide to XRF Analysis to Meet IPC Specifications for Printed Board Surface Finishes’ we discuss four main types of printed board finish, and how best to meet IPC specifications for each one.
Manufacturers’ Guide to XRF Analysis to Meet IPC Specifications for Printed Board Surface Finishes covers:
What happens to the component if you don’t meet the right specifications
Why too thick can be as bad as too thin for some surface deposits
Instances where your XRF measurements might be wrong
Advice on how to set up your XRF equipment to get the right reading every time