Do you struggle to meet today’s electronic demand for greater speed, efficiency, power, and decreased weight?

See More

Our presentation has some answers that can help with the practical application of X-Ray Fluorescence (XRF) in semiconductor packaging  

The presentation covers:

  • XRF principles, and how XRF can be adopted to measure components down to the nanometer range.
  • Levels of precision for specific plating types, including: Electroless Ni, Au, Al and Ti plating and under bump metallurgy (UBM).
  • Why XRF is easier and faster for the measurement of practical elements, covering from sample holders to what lighting.
  • The affects of measurement time on the precision of results.


Download the Presentation

We send out regular marketing news, updates, promotions and offers by email so sign up if you’d like to keep in the know. You can opt out at any time.

Compare the FT150 and EA6000VX

  • High Resolution SDD
  • Element range : Al-U
  • Chamber design : closed
  • XY stage options : motorised, wafer
  • Largest sample : 600 x 600 x 20 mm
  • Filters : 1 or 3
  • Polycapillary < 20 µm
  • XRF Controller
Get a quote or demo
  • High resolution SDD
  • Element range : Mg - U (Na - U when using helium purge)
  • Chamber design : closed
  • XY stage options : motorised
  • Largest sample : 270 x 220 x 150 mm
  • Maximum number of collimators : 4
  • Filters : 6 mode automatic switching
  • Smallest collimator : 0.2mm
  • X-ray Station & Mapping Station software
Get a quote or demo