International Wafer-Level Packaging Conference 2019

IWLPC brings together the semiconductor industry’s most respected authorities on wafer-level, 3D device packaging, advanced manufacturing & test technologies.

Talk to our coating experts at booth 48

 Hitachi High-Tech Analytical Science has been a provider of X-ray Flourescence (XRF) coating instruments for over 40 years. In the semiconductor industry XRF is used for analysis and quality control of micro-scale semiconductor packaging. XRF's main advantage for measurement of semiconductors is its capablity to produce reliable measurements through the non-destructive analysis of multilayered plating samples.

With the miniaturization and increasing complexity of electronic devices, proliferated by advancements in smartphone functionality, continues with the rise of microelectromechanical systems (MEMS). For applications relating to MEMS, an XRF plating thickness analyzer capable of high accuracy measurement in small areas is essential.

Be sure to join in on our presentation titled: The latest in XRF coatings analysis equipment for micro-scale semiconductor packaging. This presentation is being held on Wednesday, October 23rd at 2PM in the Cedar Ballroom. Hope to see you there!

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Dates: 22 October 2019 - 24 October 2019

Venue: DoubleTree by Hilton San Jose, San Jose, CA